Boron Nitride thermal paste Slice engineering for improving conduction

Boron Nitride thermal paste Slice engineering for improving conduction

Boron Nitride thermal paste Slice engineering for improving conduction

• Boron Nitride thermal paste from Slice Engineering is a high-performance compound for improving heat conduction in 3D printer hotend components.
• It boosts thermal transfer between the heater cartridge and heat block, improving heat dissipation and helping extend heater life.
• Unlike anti-seize compounds, boron nitride is not electrically conductive, reducing the risk of shorting a heater cartridge or thermistor.
• Also acts as a release agent to help prevent parts like heaters, thermistors, and nozzles from getting permanently stuck in the hot block.

Specifications

• Product: Slice Engineering Boron Nitride thermal paste
• Type: thermal paste for improving conduction + release agent
• Packaging: 1 cc syringe with luer lock fitting
• Electrical property: non‑conductive
• Temperature stability: 850°C in air, 1800°C in vacuum
• Composition: boron nitride particles in aqueous suspension (dries after heating)

Features

• Improves heat conduction for more even hot block temperature distribution
• Helps improve heater cartridge life by better heat dissipation
• Non‑electrically conductive to reduce short-circuit risk
• Works as a release agent to prevent sticking/seizing of hotend components
• Leaves a clay-like, crystalline, highly conductive layer after heating and drying

Applications

• Coating the cartridge heater hole in a 3D printer heat block
• Improving thermal transfer in hotends for stable temperatures and consistent extrusion
• Preventing seized heater cartridges, thermistors, and nozzles
• Maintenance and upgrades for high-temperature printing setups

Package Include

• 1 pcs of Boron Nitride thermal paste.